Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight 1d —
Cap-weighted 1d —
Momentum (drift) 1d —
Constituents in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap; below ten names the cap is infeasible, so the sub-index is equal weight by construction) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
042700.KSHanmi SemiconductorKorea225000.00-2.60%-6.44%-0.44%-35.16%-29.02%+176.93%KRW
NDSNNordsonUS308.31-1.96%-3.16%-0.54%+6.97%+15.58%+36.12%USD
0522.HKASMPTAsia-other154.30-4.64%-7.99%-12.33%-23.92%+39.51%+128.59%HKD
KLICKulicke & SoffaUS79.45-7.76%-2.65%-17.07%-29.77%+23.81%+106.19%USD
LPK.DELPKF Laser & ElectronicsEurope11.85-8.14%-13.50%-21.26%-53.71%+84.01%+68.09%EUR
BESI.ASBESIEurope175.95-7.03%-13.11%-24.65%-43.26%-6.04%+53.10%EUR

FAQ · from the current data · as of 2026-09-14

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-09-14: leading — Hanmi Semiconductor (042700.KS) -0.44%; Nordson (NDSN) -0.54%; ASMPT (0522.HK) -12.33%. Lagging — BESI (BESI.AS) -24.65%; LPKF Laser & Electronics (LPK.DE) -21.26%; Kulicke & Soffa (KLIC) -17.07%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-09-14: Hanmi Semiconductor (042700.KS) +176.93%; ASMPT (0522.HK) +128.59%; Kulicke & Soffa (KLIC) +106.19%. Weakest: Nordson (NDSN) +36.12%; BESI (BESI.AS) +53.10%; LPKF Laser & Electronics (LPK.DE) +68.09%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.